发明名称 Schleifmittelzusammensetzung und Polierverfahren unter Verwendung derselben
摘要 A polishing composition which comprises the following components (a) to (d): (a) silicon dioxide, (b) at least one basic substance selected from the group consisting of an inorganic salt of an alkali metal, an ammonium salt, piperazine and ethylenediamine, (c) at least one chelating agent selected from the group consisting of a compound represented by the following general formula �1� and its salt: <CHEM> wherein each of R1 and R2 which are the same or different, is a lower alkylene group, and n is an integer of from 0 to 4, and (d) water.
申请公布号 DE60225956(D1) 申请公布日期 2008.05.21
申请号 DE2002625956 申请日期 2002.01.30
申请人 FUJIMI INC. 发明人 KAWASE, AKIHIRO;OKAMURA, MASAO;INOUE, YUTAKA
分类号 C09G1/02;C09K3/00;B24B37/00;C09K3/14;H01L21/304;H01L21/306;H01L21/321 主分类号 C09G1/02
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