发明名称 |
CIRCUIT BOARD AND ITS MANUFACTURING METHOD |
摘要 |
The present invention provides a circuit board in which peeling strength is prevented from decreasing and connection resistance to conductive material is prevented from increasing, though the contact area decreases when the circuit board has a copper foil. This circuit board has metal film (105) for covering a through hole on at least one surface of insulating substrate (101) having the through hole filled with conductive material (104). Uneven layer (1069 with a thickness of 5 mu m or more is formed on a surface of metal film (105), and a metal layer is formed on the opposite surface to uneven layer (106). <IMAGE> |
申请公布号 |
EP1357775(A4) |
申请公布日期 |
2008.05.21 |
申请号 |
EP20020775418 |
申请日期 |
2002.10.30 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD |
发明人 |
SUGAWA, TOSHIO;TAKASE, YOSHIHISA |
分类号 |
H05K1/11;H05K1/03;H05K3/00;H05K3/06;H05K3/10;H05K3/18;H05K3/24;H05K3/38;H05K3/40;H05K3/46;(IPC1-7):H05K3/38 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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