| 摘要 |
PROBLEM TO BE SOLVED: To provide a board transfer apparatus which can efficiently and surely conduct transferring the substrate mounted with filmy electronic parts without dropping the filmy electronic parts and board damage and the like. SOLUTION: The board transfer apparatus 11 possesses a first transfer mechanism 20 supporting a glass substrate 31 and a second transfer mechanism 21 which is operated involved in transfer the glass substrate 31 by the first transfer mechanism 20 and transferred supporting the filmy electronic parts 32 mounted on the glass substrate 31. The first transfer mechanism 20 is provided with a moving mechanism, which can move the substrate transfer belts 12a, 12b for the first transfer mechanism 20, in such a manner that the glas substrate 31 is supported from the bottom surface side, from the turnout position to the supporting position each in a vertical direction. The second transfer mechanism 21 is provided with the moving mechanism, which can move electronic parts transfer belts 16a, 16b for the second transferring mechanism 21, in such a manner that the filmy electronic parts 32 are supported from the bottom surface side, from the turnout position to the supporting position each in a circular motion. |
