A process for manufacturing a multilayer printed circuit board

摘要

A process for manufacturing a multilayer printed circuit board comprises a step for providing openings in an interlayer insulating layer (4002), and a step for filling up the openings with a plating metal to construct via holes (4007) and, at the same time, build up an upper-layer conductor layer (4005). The electroplating is performed using an aqueous solution containing a metal ion and 0.1 to 1.5 mmol/L of at least one additive selected from the group consisting of thioureas, cyanides and polyalkylene oxides as a plating solution.