| 摘要 |
<p>A method for manufacturing an electric board and a method for manufacturing a multi-layer wiring board are provided to obtain high electric conduction between a wiring and electronic components even when an insulating layer is formed around the electronic components using a droplet discharging method. A method for manufacturing an electric board includes the steps of: forming protrusions(72) having conductivity on a conduction part(71) together with arranging electric components(70) having the conduction part on a first insulating layer(50); forming a second insulating layer(60B) on a top surface of the electronic components to a height for protruding the protrusions by using a droplet discharging method; forming a conductive wiring to connect with the protrusions on the second insulating layer; and forming a third insulating layer(60A) to the same height as the second insulating layer by coating the insulating material around the electronic components using the droplet discharging method.</p> |
