Memory module assembly including a clamp for mounting heat sinks thereon

摘要

A memory module assembly includes a pair of heat-dissipation plates ( 10 ), a printed circuit board ( 20 ) sandwiched between the heat-dissipation plates ( 10 ), and four clamps ( 30 ) for securing the heat-dissipation plates ( 10 ) onto opposite sides of the printed circuit board ( 20 ). Each clamp includes a connecting portion ( 32 ) and a pair of elastic pressing portions ( 34 ) extending from opposite free ends of the connecting portion. Each pressing portion has a pair of hooks ( 342 ) extending from opposite lateral sides thereof and an engaging portion extending ( 344 ) from a free end thereof and clamping on an end of the heat-dissipation plate. The hooks are inserted into openings ( 18 ) defined in the heat-dissipation plates and engage with inner surfaces of the heat-dissipation plates.