| 摘要 |
A wafer lifting apparatus in semiconductor device fabrication equipment is provided to facilitate up/down motions of a wafer lift shaft by installing a bearing as a frictional resistance reducing unit, thereby preventing the wafer lift shaft from being polluted by particles. A wafer lifting apparatus in semiconductor device fabrication equipment comprises a motor(21), a wafer lift shaft(22), a lift pin(26), and a frictional resistance reducing unit(29). The motor generates a driving force for lifting a wafer. The wafer lift shaft receives the driving force of the motor to be raised. The lift pin is extended to one end of the wafer lift shaft to load and unload the wafer through a disk(8). The frictional resistance reducing unit, which is a bearing, is installed between the wafer lift shaft and a shaft keeping unit(23) to attenuate the frictional force of up/down motions of the wafer lift shaft.
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