发明名称 Apparatus for processing an object with high position accurancy
摘要 A apparatus processes an object ( 19 ), such as a semi-conductor wafer at accurately controlled positions. The object ( 19 ) is supported by a working platform ( 12 ) that is moveable along a path. A suspension actuator part ( 14 ) attached to the working platform ( 12 ), contains a soft magnetic core ( 24 ) with poles facing the surface of a soft magnetic element ( 34 ) on the support structure along the path and a winding ( 20 ) for application of a current to generate a magnetic field that runs through the core ( 24 ) v the poles and returns via the soft magnetic element ( 34 ). A sensor ( 17 ) senses a measured position of the suspension actuator part ( 14 ) relative to the position reference element ( 16 ). A control circuit comprises an outer control circuit ( 40 ) and an inner control circuit ( 42 ). The outer control circuit ( 40 ) receives a sensing result and determines force set point information to regulate the measured position of the actuator part ( 14 ) to a required value. The inner control circuit ( 42 ) receives the force set point information and controls the current to realize a force between the actuator part ( 14 ) and the support structure ( 10 ) according to the force set point information.
申请公布号 US7375479(B2) 申请公布日期 2008.05.20
申请号 US20030539371 申请日期 2003.12.15
申请人 KONINKLIJKE PHILIPS ELECTRONICS, N.V. 发明人 VAN EIJK JAN;BAKKER ARJAN FRANKLIN;BOS DENNIS ERWIN;COMPTER JOHAN CORNELIS;DE KLERK ANGELO CESAR PETER;ROES FRANCISCUS MARTINUS;VROOMEN HUBERT GERARD JEAN JOSEPH AMAURY;WARMERDAM THOMAS PETRUS HENDRICUS
分类号 H02K41/00;F16C39/06;G03F7/20;G03F9/00;H01J37/20;H01J37/317;H01L21/68;H02K11/00;H02K41/03;H02P1/00;H02P3/00;H02P5/00;H02P7/00 主分类号 H02K41/00
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