发明名称 Method for fabricating thin film transistor
摘要 When a gettering sink is removed by using alkaline solution of etchant having a high selectivity to the gettering sink and a barrier film functioning as an etching stopper, residue of gettering is left. However, according to the present invention, a semiconductor film that serves as a gettering sink contains nitrogen at concentration of 1x10<SUP>18 </SUP>atoms/cm<SUP>3 </SUP>or lower, oxygen at concentration of 8x10<SUP>19 </SUP>atoms/cm<SUP>3 </SUP>or lower, and noble gas at concentration is of 1x10<SUP>20 </SUP>atoms/cm<SUP>3 </SUP>or higher. In order to achieve the above-described impurity concentrations, a concentration of oxygen that is an impurity element in a chamber is reduced by using a flammable gas for heating and exhausting oxygen.
申请公布号 US7374976(B2) 申请公布日期 2008.05.20
申请号 US20030713219 申请日期 2003.11.17
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 MAEKAWA SHINJI;AKIMOTO KENGO
分类号 H01L21/00;H01L21/20;H01L21/336 主分类号 H01L21/00
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