Semiconductor device packaging substrate and semiconductor device packaging structure

摘要

A packaging substrate for a semiconductor device includes: a solder resist on a surface of the packaging substrate, the solder resist having a first opening portion for mounting the semiconductor device; and a speed adjusting opening portion for adjusting a flow speed of an underfill resin when the underfill resin is provided, the adjusting section being positioned in vicinity of the first opening portion of the solder resist.