| 摘要 |
An apparatus 100) and method of embedding a laser source (120) on a semiconductor substrate (105) and an optical interconnect to couple the laser source (120) to internal components of the semiconductor substrate. An on-die waveguide is integrated on the semiconductor substrate (105). A package waveguide (125) is disposed on the semiconductor substrate (105) and evanescently coupled to the on-die waveguide (130). The laser source (120) is embedded within the package waveguide (125) to provide an optical signal to the on-die waveguide (130) via the package waveguide (125).
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