| 摘要 |
A wafer grinding wheel and a wafer grinding method using the same are provided to obtain a wafer of high quality by improving the surface roughness of the grinded wafer. A wafer is disposed on a chuck table, and then the wafer is rotated by rotating the chuck table. A grinding wheel is rotated, and then any one of the grinding wheel and the chuck table is moved towards a thickness direction of the wafer so that a grinding pad(20) comes in contact with a surface of the wafer to grind the wafer. The chuck table is rotated at the rate of 250 rpm, and the grinding wheel is rotated at the rate of 900 to 1500 rpm. The grinding wheel is moved at a transfer speed of 0.1 to 0.3 mum per second.
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