| 摘要 |
A wet etching device is provided to enable uniform spray of an etching solution onto a substrate during a wet etching process, to improve the work efficiency and to reduce the cost. A wet etching device comprises: a chamber; a substrate conveying unit for conveying a substrate into the chamber; a main pipeline to which an etching solution(117) is supplied from an etching solution storage container present in the exterior of the chamber; a plurality of sub-pipelines(123) branched from the main pipeline; and a spray nozzle(125) whose etching solution inlet is linked to the upper part of the sub-pipelines and whose etching solution ejection port(124a) is bent downwardly. |
