| 摘要 |
A dipping device for a semiconductor die bonding apparatus is provided to easily adjust the height of the flux received in a flux disc by controlling the height of a flux receiving part. Flux is applied on supper surface of a flux disc, and flux receiving parts(122), which are installed on the flux disc, has a flux pocket and planarize the flux applied on the upper surface of the flux disc. A driving belt connects a pulley coupled to a rotation shaft of a driving motor(150) with a pulley coupled to rotation shafts of the flux disc. The flux disc has a first flux disc(111) and a second flux disc(112). The driving pulley rotates a first pulley(141) coupled to the first flux disc and a second pulley(142) coupled to the second flux disc. |
