SEMICONDUCTOR DEVICE HAVING CHIP ON FILM STRUCTURE AND METHOD OF FABRICATING THE SAME

摘要

A semiconductor device having a chip on film structure and a method of manufacturing the same are provided to prevent a bump from being twisted due to thermal stress after adhesion between a bond finger and the bump. A semiconductor device having a chip on film structure includes a semiconductor chip(310), a bump(340), a resin layer(330), a circuit board(370), and a bond finger(360). The semiconductor chip has pads. The bump is attached to the pad. The resin layer covers the semiconductor chip around the bump and protrudes from the bump. The circuit board overlaps with the semiconductor chip. The bond finger is disposed on the circuit board and comes in contact with the bump. The bond finger protrudes from the circuit board to the bump. The circuit board is a flexible circuit printed board. The resin layer is made of photoresist material.