| 摘要 |
[PROBLEMS] To provide a production method of a printed wiring board in which a bump of desired height can be formed within a requested error range while connection reliability between a solder bump and a conductor pad is ensured. [MEANS FOR SOLVING PROBLEMS] A solder ball (80) is mounted to a low-profile bump (78S) (Fig. 5(B)), and then the height of the bump is increased by thermally fusing the solder ball (80) with laser (Fig. 5(C)). Consequently, the heights of the bumps can be aligned within a requested error range. Since the bump is not removed by heating when the height of the low bump (78S) is increased, local heat history is not imparted and reliability of bump on a printed wiring board can be enhanced. |
