PCB FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

A printed circuit board for manufacturing a semiconductor package is provided to prevent a wrong bonding effect in a wire bonding process by forming some conductive patterns for identification. A printed circuit board includes conductive patterns(30) for wire bonding. The conductive patterns have the same size and the same shape. A solder mask layer for covering the conductive pattern of each corner part is uncovered to the outside in order to form the conductive pattern having a structure for increasing the exposed area. The conductive patterns having the same size and the same shape are partially uncovered to increase the exposed area and to form conductive patterns for identification.