Planar etching of dissimilar materials

摘要

A method of planar etching of dissimilar materials with a Focused Ion Beam (FIB) system such as the OptiFIB manufactured by Credence Systems. The method includes adjusting the selectivity between the two materials, which varies when the ratio of the assisting chemistry pressure to the ion dose rate changes. This method can be used in such applications as FIB circuit edit, failure analysis, and cross sectioning.