An integrated circuit package system is provided including forming a paddle, forming a ring with a recess in the paddle, mounting a device in the recess, forming a slot in the ring, and mounting a heat sink in the slot over the device.
申请公布号
US2008111217(A1)
申请公布日期
2008.05.15
申请号
US20060558413
申请日期
2006.11.09
申请人
STATS CHIPPAC LTD.
发明人
DIMAANO ANTONIO B.;SHIM IL KWON;BATHAN HENRY D.;PUNZALAN JEFFREY D.
