发明名称 CARRIER BOX FOR SEMICONDUCTOR PACKAGE
摘要 A carrier box for a semiconductor package is provided to stably receive various sizes and shapes of semiconductor packages and easily carry them by using an auxiliary cushion member. A carrier box(100) includes a first tray(200) and a second tray(300). A plate shaped semiconductor package is inserted into and received at a side in the first tray. Plural receiving grooves(310) that have different sizes, shapes, and depth are formed on an upper surface of the second tray at the other side adjacent to the first tray. The first tray is made of ethylene vinyl acetate. Slots(210) are formed at both opposite sides in the first tray. Both ends of the plate shaped semiconductor package are respectively inserted into the slots. The second tray is comprised of plural unit trays(300a,...300n) made of polyethylene form. A cushion member(140) made of poly urethane is attached to an inner circumference of the carrier box. A cushion member(150) is installed between a main frame and the tray to reduce impact of the tray.
申请公布号 KR20080042480(A) 申请公布日期 2008.05.15
申请号 KR20060110984 申请日期 2006.11.10
申请人 SEYOUNG I&C., LTD. 发明人 WOO, CHAN DONG
分类号 H01L21/68 主分类号 H01L21/68
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