| 摘要 |
A multi layer circuit board (MPCB) is disclosed that is comprised of a first layer and a fourth layer substantially parallel to the first layer. Pluralities of electrical contacts are formed on the first layer of the multilayer circuit board and are disposed in a first grid. The plurality of electrical contacts are divided into a first subset for routing within the first layer, and a second subset for routing within the fourth layer. A plurality of vias are formed between the first and fourth layers and each disposed adjacent at least one of the second subset of the plurality of electrical contacts, the plurality of vias having a spacing between each pair thereof larger than a smallest spacing between adjacent electrical contacts of the plurality of electrical contacts. |
