| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer with an adhesive layer using an adhesive constituted of a liquid resin composition to be used in an adhesive layer of a semiconductor device with the adhesive layer which can be mounted on a support at low temperatures and is not sticky at room temperature, a semiconductor device with the adhesive layer, and furthermore a semiconductor package using the semiconductor device with the adhesive layer. SOLUTION: The liquid resin composition comprises a compound (A) having a glycidyl group and a compound (B) having a phenolic hydroxy group, and the compound (B) comprising a compound (B1) having a molecular weight of not higher than 1,000 and a compound (B2) having a molecular weight of 1,500 to 5,000. COPYRIGHT: (C)2008,JPO&INPIT
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