| 摘要 |
An electronic multi -component package (74, 75) is assembled by placing multiple electronic components (30) within multiple openings (16) of a package substrate (12), then depositing and curing adhesive filler (34) in gaps between the components and the inner peripheries of the openings. Circuit features (38, 42), including conductive interconnects, are formed by thin-film photolithography over both front and back surfaces (22F, 22B) of the package substrate. Preformed conductive vias (18) through the package substrate provide electrical connection between circuit features on opposite substrate surfaces. Additional electronic components (50, 54, 58) may be attached (52, 56, 60) to conductive lands on at least one side of the package. The circuit features also include contact pads (66) for external package connections, such as in a ball-grid-array or equivalent structure. |
