发明名称 HEATING UNIT STRUCTURE OF BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heating unit structure of a bonding device capable of suppressing the difference in temperature generated between respective bonding points even though a width of a work is wide. SOLUTION: A temperature control region by a heating head 11 of a conveyance rail 3 is divided into two in a width direction, and temperatures of each divided temperature control regions 41, 42 are independently controlled. More specifically, a back row temperature sensor 71, a back row heater insertion hole 52, and a back row cartridge heater 62 inserted into the each back row heater insertion hole 52 are provided at the back row side of the conveyance rail 3, and the heating head 11 of the back row temperature control region 41 is comprised. A front row temperature sensor 121, a front row heater insertion hole 102, and a front row rod cartridge heater 103 inserted into the front row heater insertion hole 102 are provided at the front side of the onveyance rail 3, and the heating head 11 of the front row temperature control region 42 is comprised. Amounts of insertion of respective cartridges heaters 62, 103 to the respective heater insertion holes 52, 102 are variably fixed. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008112873(A) 申请公布日期 2008.05.15
申请号 JP20060295024 申请日期 2006.10.31
申请人 NIDEC TOSOK CORP 发明人 ENDO SHINICHI;OGASAWARA KAZUKI;KONUMA TAKUMI
分类号 H01L21/60;H01L21/52 主分类号 H01L21/60
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