EMI SHIELDING AND THERMAL MANAGEMENT ASSEMBLIES INCLUDING FRAMES AND COVERS WITH MULTI-POSITION LATCHING
摘要
According to various aspects of the present disclosure, exemplary embodiments are of assemblies capable of providing board level EMI shielding and heat dissipation of one or more electrical components. Other aspects relate to components of such assemblies. Further aspects relate to methods of using EMI shielding and thermal management assemblies. Additional aspects relate to methods of making EMI shielding and thermal management assemblies, and methods of making the components thereof.
申请公布号
WO2007103741(A3)
申请公布日期
2008.05.15
申请号
WO2007US63091
申请日期
2007.03.01
申请人
LAIRD TECHNOLOGIES, INC.;ENGLISH, GERALD, ROBERT;ZUEHLSDORF, ALLAN, RICHARD
发明人
ENGLISH, GERALD, ROBERT;ZUEHLSDORF, ALLAN, RICHARD