发明名称 METHOD FOR VACUUM PROCESSING AND VACUUM TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To selectively perform a process for carrying out a common process to wafers in one cassette, and a process for carrying out a different process to wafers in two cassettes, when the wafers in the cassettes are transferred to a processing apparatus for carrying out process. SOLUTION: A parallel process uses one cassette; wafers stored in the cassette are transferred to one of process treatment apparatuses by means of a transfer means, a load-lock chamber, and a vacuum transfer means; and a common recipe is applied to the transferred wafers for performing a common process. Another parallel process uses at least two cassettes; wafers stored in the cassette are transferred to process treatment apparatuses respectively different for the every cassette by means of the transfer means, the load-lock chamber, and the vacuum transfer means; and the recipes respectively different for each of the process treatment apparatuses are applied to the transferred wafers for performing different processes. The parallel process or the another parallel process is selectively performed. At the same time, the wafer is returned to the original cassette by means of an unload-lock chamber after the parallel process. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008113032(A) 申请公布日期 2008.05.15
申请号 JP20080011462 申请日期 2008.01.22
申请人 HITACHI LTD;HITACHI HIGH-TECHNOLOGIES CORP 发明人 NISHIHATA KOJI;SHIROO KAZUHIRO;IKUHARA SHIYOUJI;TAWARA TETSUYA;OKIGUCHI MASASHI
分类号 H01L21/677 主分类号 H01L21/677
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