发明名称 FILM-FORMING APPARATUS AND FILM-FORMING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To reduce interference due to capacitance generated between power feeders for feeding a high-frequency power to voltage-applying electrodes, without increasing a space between the power feeders. <P>SOLUTION: The two voltage-applying electrodes 8 which are connected with each other through an exhaust gas block 11 are arranged between two lines of flexible substrates 1 which are transported in parallel, and a conductor plate 27 for reducing a high-frequency current flowing in between the feeders 26 for feeding the high-frequency power to each voltage-applying electrodes 8 is arranged between the feeders 26. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008111144(A) 申请公布日期 2008.05.15
申请号 JP20060293145 申请日期 2006.10.27
申请人 FUJI ELECTRIC HOLDINGS CO LTD 发明人 SHIMIZU HITOSHI
分类号 C23C16/505;H01L21/205;H01L31/04 主分类号 C23C16/505
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