发明名称 HYBRID ORIENTATION SUBSTRATE AND METHOD FOR FABRICATION THEREOF
摘要 A method for fabricating a hybrid orientation substrate provides for: (1) a horizontal epitaxial augmentation of a masked surface semiconductor layer that leaves exposed a portion of a base semiconductor substrate; and (2) a vertical epitaxial augmentation of the exposed portion of the base semiconductor substrate. The resulting surface semiconductor layer and epitaxial surface semiconductor layer adjoin with an interface that is not perpendicular to the base semiconductor substrate. The method also includes implanting through the surface semiconductor layer and the epitaxial surface semiconductor layer a dielectric forming ion to provide a buried dielectric layer that separates the surface semiconductor layer and the epitaxial surface semiconductor layer from the base semiconductor substrate.
申请公布号 US2008111214(A1) 申请公布日期 2008.05.15
申请号 US20060559151 申请日期 2006.11.13
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 YANG HAINING S.;UTOMO HENRY K.;HOLT JUDSON R.
分类号 H01L29/04;H01L21/36 主分类号 H01L29/04
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