发明名称 REMOVAL OF OXIDATION LAYER FROM METAL SUBSTRATE AND DEPOSITION OF TITANIUM ADHESION LAYER ON METAL SUBSTRATE
摘要 <p>An oxidation layer is removed from a metal substrate by plasma etching (308). A titanium adhesion layer is deposited on the metal substrate (310). A multiple-layer dielectric is deposited on the titanium adhesion layer (316). The titanium adhesion layer improves adhesion of the multiple-layer dielectric to the metal substrate.</p>
申请公布号 WO2008057742(A1) 申请公布日期 2008.05.15
申请号 WO2007US82060 申请日期 2007.10.22
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;WU, KUOHUA;VAN BROCKLIN, ANDREW L. 发明人 WU, KUOHUA;VAN BROCKLIN, ANDREW L.
分类号 C23C28/00;C23C14/02;C23C14/08;C23C14/10;C23C16/02;C23C16/40 主分类号 C23C28/00
代理机构 代理人
主权项
地址