发明名称 |
REMOVAL OF OXIDATION LAYER FROM METAL SUBSTRATE AND DEPOSITION OF TITANIUM ADHESION LAYER ON METAL SUBSTRATE |
摘要 |
<p>An oxidation layer is removed from a metal substrate by plasma etching (308). A titanium adhesion layer is deposited on the metal substrate (310). A multiple-layer dielectric is deposited on the titanium adhesion layer (316). The titanium adhesion layer improves adhesion of the multiple-layer dielectric to the metal substrate.</p> |
申请公布号 |
WO2008057742(A1) |
申请公布日期 |
2008.05.15 |
申请号 |
WO2007US82060 |
申请日期 |
2007.10.22 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;WU, KUOHUA;VAN BROCKLIN, ANDREW L. |
发明人 |
WU, KUOHUA;VAN BROCKLIN, ANDREW L. |
分类号 |
C23C28/00;C23C14/02;C23C14/08;C23C14/10;C23C16/02;C23C16/40 |
主分类号 |
C23C28/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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