发明名称 Verfahren und Vorrichtung zur Montage von elektronischen Bauteilen
摘要 The invention is directed to increased stabilization of a pickup operation by reducing a reaction against disturbance by reducing a feedback value when a pickup rate is improved. A positional shifting amount of an electronic component on a suction nozzle before the electronic component is mounted on a printed board is stored in a RAM each time the component is picked up at a component feeding unit until a pickup count number reaches a predetermined pickup number, and a CPU calculates an average of the positional shifting amounts. When the pickup count number reaches the predetermined pickup number, the CPU obtains a temporary coefficient by adding an initial value to a value obtained by multiplying a negative coefficient by the pickup count number, and calculates a feedback value by multiplying the temporary coefficient by the average. The calculated feedback value is added to an offset value of a component pickup position to modify the offset value, and uses the offset value in the next pickup operation at the component feeding unit.
申请公布号 DE602005005735(D1) 申请公布日期 2008.05.15
申请号 DE20056005735T 申请日期 2005.04.27
申请人 HITACHI HIGH-TECH INSTRUMENTS CO. LTD. 发明人 KANO, YOSHINORI;TOMIFUKU, TAKESHI;OKAMOTO, YOSHINORI;USUI, YOSHINAO;TAKEMURA, IKUO
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
主权项
地址