| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method of a wafer which does not lower productivity even if the cutting state of a cut wafer is inspected. SOLUTION: An inspection process for inspecting the cutting state including the state of the width and the state of chip of a cut groove of a cut wafer is executed in a cutting process wherein a wafer held in another chuck table is cut by using two chuck tables by first and second chuck tables. Consequently, the cut state of a wafer can be inspected without sacrificing through put and to improve productivity of a wafer to be cut and processed. COPYRIGHT: (C)2008,JPO&INPIT |
