| 摘要 |
PROBLEM TO BE SOLVED: To provide a compound semiconductor device of which adhesive strength is improved while keeping its electric characteristic. SOLUTION: The compound semiconductor device is provided with a substrate made of compound semiconductor and a rear gold electrode that is provided on the rear surface of the substrate and has a plurality of openings. The openings are formed like mesh, and a straight line connecting mutually closest openings is not parallel to a cleaved face formed at the end face of the substrate. COPYRIGHT: (C)2008,JPO&INPIT
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