| 摘要 |
PROBLEM TO BE SOLVED: To prevent edges of a cleaved plane from chipping by external force applied when in mechanically gauging or carrying a processing substrate. SOLUTION: The apparatus for cleaving 10 comprises a substrate holder 50 holding the processing substrate 60, a laser heating part 30 regionally heating by irradiating the processing substrate 60 at a region in the vicinity of a line 65 scheduled to cleave with a laser beam LB2, and a cooling part 40 spraying a cooling agent C having fluidity on the processing substrate 60 held by the substrate holder 50 at a region heated with the laser beam LB2 in the vicinity of the line 65 scheduled to cleave. The cooling agent C spraying from the cooling part 40 contains a protective material 1 which protects the edges 60e of the cleaved plane 60t of the processing substrate 60 by sticking on the surface of the processing substrate 60 to remain. COPYRIGHT: (C)2008,JPO&INPIT
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