SEMICONDUCTOR DEVICE PACKAGE

摘要

Provided is a semiconductor device package. The semiconductor device package includes: stacked semiconductor chips having bonding pads; a PCB (printed circuit board) mounting the stacked semiconductor chips thereon, and including bonding electrodes that correspond to the bonding pads; and interposers respectively covering the stacked semiconductor chips and interposed between the stacked semiconductor chips. The interposers comprise wire patterns connecting the bonding pads with the bonding electrodes, and connecting the interposers to each other.