发明名称 |
IMAGE SENSOR INCLUDING SPATIALLY DIFFERENT ACTIVE AND DARK PIXEL INTERCONNECT PATTERNS |
摘要 |
An interconnect layout, an image sensor including the interconnect layout and a method for fabricating the image sensor each use a first electrically active physical interconnect layout pattern within an active pixel region and a second electrically active physical interconnect layout pattern spatially different than the first electrically active physical interconnect layout pattern within a dark pixel region. The second electrically active physical interconnect layout pattern includes at least one electrically active interconnect layer interposed between a light shield layer and a photosensor region aligned therebeneath, thus generally providing a higher wiring density. The higher wiring density within the second layout pattern provides that that the image sensor may be fabricated with enhanced manufacturing efficiency and a reduction of metallization levels.
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申请公布号 |
US2008111159(A1) |
申请公布日期 |
2008.05.15 |
申请号 |
US20060560019 |
申请日期 |
2006.11.15 |
申请人 |
GAMBINO JEFFREY P;JAFFE MARK D;LEIDY ROBERT K;RASSEL RICHARD J |
发明人 |
GAMBINO JEFFREY P.;JAFFE MARK D.;LEIDY ROBERT K.;RASSEL RICHARD J. |
分类号 |
H01L31/101;H01L21/339;H01L23/52;H01L29/765 |
主分类号 |
H01L31/101 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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