| 摘要 |
PROBLEM TO BE SOLVED: To provide a foil-like capacitor which is manufactured through a process of forming a via-hole by laser processing, exhibits no deterioration of a dielectric layer, and has fine characteristics, to provide a wiring board using the capacitor, and to provide a manufacturing method for the wiring board. SOLUTION: The foil-like capacitor 3 is made by forming capacitance forming electrodes 32 and 33 on one main surface 41 and the other main surface 42 of the dielectric layer 31, respectively. One main surface has a floating electrode 32b that is so formed as to encircle a via-hole formation scheduled area 5a, an electrode non-formation portion 32a formed around the floating electrode, and one surface side capacitance forming electrode 32 that is formed around the floating electrode via the electrode non-formation portion. The other main surface has a floating electrode 33b that is so formed as to encircle the via-hole formation scheduled area 5a, an electrode non-formation portion 33a formed around the floating electrode, and the other surface side capacitance forming electrode 33 that is formed around the floating electrode via the electrode non-formation portion. COPYRIGHT: (C)2008,JPO&INPIT
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