| 摘要 |
The invention relates to a microelectronic subassembly comprising at least two circuit support layers (1, 2, 3) which are disposed parallel on top of one another, are formed by different sections of a folded substrate that is flexible in at least some areas, are equipped with electronic components, and are mechanically interconnected by means of at least one surface-mounted component (4, 4') that is part of a circuit on at least one of the circuit support layers (1, 2, 3). The invention further relates to a method for producing such a microelectronic subassembly. |
| 申请人 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.;POLITYKO, DMITRY, DAVID;WENZEL, STEPHAN;JUNG, ERIK;HEFER, JAN;NIEDERMAYER, MICHAEL;GUTTOWSKI, STEPHAN |
发明人 |
POLITYKO, DMITRY, DAVID;WENZEL, STEPHAN;JUNG, ERIK;HEFER, JAN;NIEDERMAYER, MICHAEL;GUTTOWSKI, STEPHAN |
