发明名称 MANUFACTURING METHOD OF WIRING CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring circuit board, capable of efficiently removing static electricity charged on an obtained wiring circuit board while preventing discoloration of a terminal portion. <P>SOLUTION: A circuit-equipped suspension board 1 provided with a metal supporting board 2, a base insulating layer 3, a conductor pattern 4 and a cover insulating layer 5 is prepared. Subsequently, a plating layer 8 is formed on the surface of a terminal portion 7, the circuit-equipped suspension board 1 is immersed in a polymerization liquid of a conductive polymer having redox potential lower than standard electrode potential of a conductor material configuring the conductor pattern 4, thereby forming a semi-conducting layer 10 on the surface of the base insulating layer 3 and the surface of the cover insulating layer 5. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008112851(A) 申请公布日期 2008.05.15
申请号 JP20060294621 申请日期 2006.10.30
申请人 NITTO DENKO CORP 发明人 ISHII ATSUSHI;OYABU KYOYA;KURAI HIROYUKI
分类号 H05K3/10;H05F1/02;H05K1/09;H05K3/24 主分类号 H05K3/10
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