| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC socket having a simple configuration for promoting the dissipation of heat from an IC device to prevent the overheating of the IC device during inspection. <P>SOLUTION: Contact pins 6c similar to contact pins 6a and 6b are arranged at positions not corresponding to the signal balls 51 and thermal balls 52 of a BAG device 5. Moreover, these contact pins 6c and second contact pins 6b in contact with the thermal balls 52 are thermally connected to each other via a heat spreader. <P>COPYRIGHT: (C)2008,JPO&INPIT |
