| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor memory card whose size and thickness can be reduced with a required shape. <P>SOLUTION: The semiconductor memory card 100 which is connected to an external device for inputting and outputting data comprises: a nearly rectangular circuit substrate 2 on which input and output terminals for inputting and outputting data to the external device are disposed on the front edge of the upper surface; a semiconductor memory chip 3 which is placed on the lower surface side of the circuit substrate 2, electrically connected to the input and output terminals, and stores data; a controller chip 4 which is placed on the lower surface side of the circuit substrate 2, and controls the semiconductor memory chip 3; and a sealing resin layer 5 which is formed over the whole lower surface of the circuit substrate 2, and seals the semiconductor memory chip 3 and the controller chip 4. <P>COPYRIGHT: (C)2008,JPO&INPIT |
