发明名称 MEMORY MODULE THERMAL MANAGEMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for implementing a technique to configure thermal management control for a memory device resident on a memory module for a computing platform, and also a method for implementing the configured thermal management control. <P>SOLUTION: In a run-time environment for a computing platform, a temperature is obtained from a thermal sensor monitoring the memory module. The memory module is in a given memory module with thermal sensor configuration that includes the memory device. An approximation of a temperature for the memory device is made based on thermal information associated with the given configuration of the memory module and the obtained temperature. The configured thermal management control for the memory device is implemented based on the approximated temperature. Other implementation forms and examples are also described in this specification and scope of claims. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008112452(A) 申请公布日期 2008.05.15
申请号 JP20070280972 申请日期 2007.10.29
申请人 INTEL CORP 发明人 SANTOS ISHMAEL;HALL CORINNE;COX CHRISTOPHER
分类号 G06F1/00;G06F12/16 主分类号 G06F1/00
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