发明名称 THERMOELECTRIC MODULE, AND METALLIZED SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a small-sized and power-saved thermoelectric module having a small-sized cross-section of a thermoelectric element and also a metallized substrate in the upper part of the cooling side that is not so small from the viewpoint of assembling in order to solve a problem that the thermoelectric element is broken with a thermal stress generated in the assembling process or with a thermal stress generated in the preliminary soldering process conducted when an object to be cooled is mounted because total mechanical strength of the thermoelectric module is lowered due to reduction in the rate of area of the element for the metallized substrate area of the thermoelectric module. SOLUTION: In the thermoelectric module 1 utilizing the Pertier effect, a slit is given to the metallized layers 4a, 4b of the thermoelectric module having an element occupation area rate of 40% or less that is defined in a rate of total sum of the cross-section perpendicular to the current feeding direction of the thermoelectric elements 5a, 5b for the area of an insulated substrate 2a in contact with a cooling object via the metallized layer 4a. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008112806(A) 申请公布日期 2008.05.15
申请号 JP20060293960 申请日期 2006.10.30
申请人 KOMATSU ELECTRONICS INC 发明人 KONISHI AKIO;YAMANASHI MASATAKA;HAJIME TAKAFUMI;FUJIKAWA SHINGO
分类号 H01L35/32;F25B21/02;H01L23/38;H01L35/30 主分类号 H01L35/32
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