| 摘要 |
A board-stacking connector has surface-mounting connections to electrical contact pads or lands on two facing surfaces on two printed circuit boards that are spaced from each other a predetermined distance in two substantially parallel planes. The connector takes the form of a generally cylindrical shell of metallic material and defines an axis and a substantially uniform cross-sectional area along that axis. The shell has a wall closed on itself to define an internal cavity forming two openings, one at each of its axial ends, and this wall further defines generally flat contact surfaces normal to said axis and surrounds each of said respective openings. One of the contact surfaces is arranged to be in contact with a pad or land on one printed circuit board and the other of the contact surfaces is arranged to be in contact with a pad or land on the other spaced printed circuit board. The internal cavity is dimensioned so as to produce capillary action of molten solder on each of the pads or lands that are in contact with the contact surfaces, so that excess solder on the pads or lands is drawn into this cavity, at both axial openings, during reflow soldering.
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