| 摘要 |
PROBLEM TO BE SOLVED: To sufficiently ensure bonding strength of a sintered metal conductor with respect to a ceramic substrate layer, and to suppress the occurrence of plating fault in the multilayer ceramic substrate manufactured by a non-contraction sintering technology. SOLUTION: The multilayer ceramic substrate has a sintered metal conductor (surface conductor 5) on the surface of a laminate on which a plurality of ceramic substrate layers 2a-2d is laminated. The surface conductor 5 formed as the sintered metal conductor is formed with a predetermined pattern so as to directly contact the ceramic substrate layers 2a, 2d, and its glass concentration on a side contacting the ceramic substrate layers 2a, 2d is larger than a glass concentration on the front surface side. In forming the surface conductor 5, at least two conductive paste layers each having a predetermined pattern are formed on ceramic green sheets 11a, 11d, and a glass content of the lowermost conductive paste layer of the conductive paste layers is made larger than a glass content of the uppermost conductive paste layer. COPYRIGHT: (C)2008,JPO&INPIT |
