| 摘要 |
PROBLEM TO BE SOLVED: To sufficiently ensure bonding strength of a sintered metal conductor with respect to a ceramic substrate layer, and to suppress the occurrence of plating fault in the multilayer ceramic substrate manufactured by a non-contraction sintering technology. SOLUTION: The multilayer ceramic substrate has a sintered metal conductor (surface conductor 5) on at least one surface of a laminate on which a plurality of ceramic substrate layers 2a-2d is laminated. The conductive material constituting the surface conductor 5 as the sintered metal conductor contains Ag as a main component and contains a noble metal having solid soldability with Ag. The noble metal is at least one kind selected from among Au, Pd and Pt. Further, the surface conductor 5 contains a glass component. COPYRIGHT: (C)2008,JPO&INPIT |
