发明名称 Backlight Structure Having Embedded LEDs and Fabrication Method Thereof
摘要 The present invention discloses a backlight structure having embedded light emitting diodes (LEDs) and a fabrication method thereof. The backlight structure comprises a PCB having a plurality of arc-shaped pits and necessary circuitry implemented thereon; a nanometer-thick gold layer sputtered on surfaces of said PCB and said plurality of arc-shaped pits; and an LED die embedded in each one of said plurality of arc-shaped pits, wherein said LED die is fused and fixed to the center of said arc-shaped pit by high frequency wave; said LED die is covered with a phosphor molding compound made by mixing phosphor and silica gel; and each one of said plurality of arc-shaped pits and its neighboring portion of PCB is covered by a window layer formed by transparent silica gel.
申请公布号 US2008112162(A1) 申请公布日期 2008.05.15
申请号 US20060558171 申请日期 2006.11.09
申请人 TOPSON OPTOELECTRONICS SEMI-CONDUCTOR CO., LTD. 发明人 CHAN TSUNG-WEN
分类号 F21V9/00;H01L33/00 主分类号 F21V9/00
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