发明名称 |
Backlight Structure Having Embedded LEDs and Fabrication Method Thereof |
摘要 |
The present invention discloses a backlight structure having embedded light emitting diodes (LEDs) and a fabrication method thereof. The backlight structure comprises a PCB having a plurality of arc-shaped pits and necessary circuitry implemented thereon; a nanometer-thick gold layer sputtered on surfaces of said PCB and said plurality of arc-shaped pits; and an LED die embedded in each one of said plurality of arc-shaped pits, wherein said LED die is fused and fixed to the center of said arc-shaped pit by high frequency wave; said LED die is covered with a phosphor molding compound made by mixing phosphor and silica gel; and each one of said plurality of arc-shaped pits and its neighboring portion of PCB is covered by a window layer formed by transparent silica gel. |
申请公布号 |
US2008112162(A1) |
申请公布日期 |
2008.05.15 |
申请号 |
US20060558171 |
申请日期 |
2006.11.09 |
申请人 |
TOPSON OPTOELECTRONICS SEMI-CONDUCTOR CO., LTD. |
发明人 |
CHAN TSUNG-WEN |
分类号 |
F21V9/00;H01L33/00 |
主分类号 |
F21V9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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