发明名称 CONNECTION STRUCTURE OF WAVEGUIDE
摘要 PROBLEM TO BE SOLVED: To obtain low-loss waveguide connection characteristics with less signal leak on the connection surface of waveguides and to prevent deterioration in the connection characteristics due to high-order mode resonation generated in displacement of the waveguide, even when a gap is generated between a multilayer dielectric substrate and a metal substrate. SOLUTION: This connection structure of the waveguides for connecting a waveguide 2 formed on the multilayer dielectric substrate 1 and a waveguide 4 formed on the metal substrate 3 includes choke structure having: a rectangle conductor pattern 7 which is formed around the waveguide 2 of the multilayer dielectric substrate 1 and has dimensions of approximatelyλ/4(λ: free space wavelength of signal waves) from the end of an E surface of the waveguide 2; a conductor opening 8 which is formed at a predetermined position on the conductor pattern 7 between the end of the conductor pattern 7 and the end of the E surface of the waveguide 2; and a dielectric transmission path 9 with short-circuited tip which is connected to the conductor opening 8 and has length of approximatelyλg/4 (λg: effective wavelength in the substrate of the signal waves) formed in the laminating direction of the multilayer dielectric substrate. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008113318(A) 申请公布日期 2008.05.15
申请号 JP20060295688 申请日期 2006.10.31
申请人 MITSUBISHI ELECTRIC CORP 发明人 SUZUKI TAKUYA
分类号 H01P1/04 主分类号 H01P1/04
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