| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device whose mounting reliability and heat dissipation efficiency are improved. SOLUTION: The semiconductor device of a flip chip mounting type bonds a semiconductor element to a mounting board through a bump electrode. The bump electrode is installed on a scribe line within an active region of the semiconductor element and that outside the active region at an outer peripheral part of the semiconductor element. The bump electrode consists of a power supply, a signal bump electrode and a dummy bump electrode for improving mounting reliability and improving heat dissipation efficiency. COPYRIGHT: (C)2008,JPO&INPIT
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