| 发明名称 |
Cleaning solutions and methods of cleaning boards using the same |
| 摘要 |
A method of cleaning a board includes dipping a board having a surface on which an organic solderability preservative (OSP) is provided into a cleaning solution having glycolic acid, a surfactant and water.
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| 申请公布号 |
US2008110477(A1) |
申请公布日期 |
2008.05.15 |
| 申请号 |
US20070985455 |
申请日期 |
2007.11.15 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JUNG KY-HYUN;SIN WHA-SU;KIM SANG-JUN;KIM JUNG-HYEON;CHOI WON-SEOK |
| 分类号 |
B08B3/04 |
主分类号 |
B08B3/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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