摘要 |
An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0,90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked. |
申请人 |
DOW GLOBAL TECHNOLOGIES INC.;PATEL, RAJEN, M.;WU, SHAOFU;BERNIUS, MARK, T.;ESSEGHIR, MOHAMED;MCGEE, ROBERT, L.;MAZOR, MICHAEL, H.;NAUMOVITZ, JOHN |
发明人 |
PATEL, RAJEN, M.;WU, SHAOFU;BERNIUS, MARK, T.;ESSEGHIR, MOHAMED;MCGEE, ROBERT, L.;MAZOR, MICHAEL, H.;NAUMOVITZ, JOHN |